Welcome to the
AI Hardware Center
The IBM Research AI Hardware Center is a global research hub headquartered in Albany, New York. The center is focused on enabling next-generation chips and systems that support the tremendous processing power and unprecedented speed that AI requires to realize its full potential.
Today’s systems have achieved improved AI performance by infusing machine-learning capabilities with high-bandwidth CPUs and GPUs, specialized AI accelerators and high-performance networking equipment. To maintain this trajectory, new thinking is needed to accelerate AI performance scaling to match to ever-expanding AI workload complexities.
The AI Hardware Center is taking a holistic approach to building AI systems from the ground up – from materials, chips, devices, architecture and the entire software stack. IBM, working with NY State and a broader ecosystem of partners, is paving the way for the next generation of artificial intelligence systems that will improve business and the lives of people all over the world.
Our researchers also played a pivotal part in creating IBM Cloud Functions, IBM Kubernetes Service, Multicloud Manager and Key Protect, as well as the development and adoption of Istio as an enterprise service mesh. Our teams were also core contributors to the IBM Cloud Gen 2 control plane and SDN.
Each of these achievements builds upon the last to ensure IBM Cloud users have access to the latest breakthroughs in cloud technology.
Join IBM and New York State to form a collaboration hub in the IBM Research AI Hardware Center.Contact us
Analog AI Cores
Analog AI cores enable in-memory storage and processing of data to speed computation and yield exponential gains in computational efficiency.
Digital AI Cores
Digital AI cores are new accelerators for existing semiconductor technologies that use reduced precision to speed computation and decrease power consumption.
AI applications drive the need for a system level optimization of AI Hardware through Heterogeneous Integration of Accelerators, Memory and CPU. The AI Hardware center will focus on interconnect solutions to enable high speed, high bandwidth connectivity between the different components.
AI technology testbed
The IBM Research AI Hardware Center will host research and development, prototyping, testing, and simulation activities for new AI cores specially designed for training and deploying advanced AI models, including a testbed in which members can demonstrate Center innovations in real-world applications. The testbed is a customizable platform for testing the accuracy and efficiency of new AI technologies for training and inferencing on image, speech, and text workloads.
Redefining AI accelerators: A new chip packaging tech & a first in analog computeNewsJeffrey Burns and John Rozen8 minute read
The hardware behind analog AIExplainerManuel Le Gallo-Bourdeau
IBM’s newest chip is more than meets the AINewsKailash Gopalakrishnan7 minute read
Open-sourcing analog AI simulationResearchKaoutar El Maghraoui, Malte Rasch, and Vijay Narayanan5 minute read
IBM Launches Research Collaboration Center to Drive Next-Generation AI HardwareNewsMukesh Khare5 minute read
The IBM Research innovations powering IBM z16NewsDonna Dillenberger5 minute read
Meet the IBM Artificial Intelligence UnitReleaseJeffrey Burns and Leland Chang
Tools + Code
AI Hardware Composer
Run an AI algorithm where computation and storage coexist on a single chip.View project →
IBM Analog Hardware Acceleration Kit
An open source Python toolkit for exploring and using the capabilities of in-memory computing devices in the context of artificial intelligence.View project →
IBM’s newest chip is more than meets the AI
Telum, an AI processor developed with technology from IBM Research, will power IBM systems.
Contact us for additional information on how to join the AI Hardware Center.Contact us